Food & Hospitality Asia (FHA) 2026 concluded after four days of trade activity, seminars and competitions, with organisers reporting its largest edition in a decade.
The event combined FHA-Food & Beverage and FHA-HoReCa into a single annual format, held alongside ProWine Singapore and IndusFood Asia at Singapore Expo. More than 2,750 exhibitors took part across 10 halls, while about 70,000 industry professionals from around 110 countries and regions attended.
The programme covered 18 segments across food, beverage and hospitality, including technology, products and operational practices. The show floor featured country pavilions from Asia-Pacific, Europe and the Americas, alongside newer participants such as Cambodia, Mongolia and the Philippines.
The European Union was featured as Region of Honour, presenting food products and sustainability initiatives. The Singapore Pavilion, led by Enterprise Singapore, included business matching sessions and a showcase developed with the Singapore Food Manufacturers Association.
A technology-focused zone, FutureFWD, highlighted developments in areas such as AI, automation and data analytics, alongside seminars and product demonstrations.
ProWine Singapore 2026 brought together more than 200 exhibitors from 24 countries, including established wine and spirits producers and newer categories such as low- and no-alcohol products. Features included tasting areas and networking sessions with buyers and distributors.
IndusFood Asia presented companies from India’s food and beverage sector, with a focus on exports, partnerships and market trends.
The Hosted Buyer Programme attracted 700 buyers from over 23 countries and regions, with around 19,000 meetings conducted over four days.
Competitions included the Young Chefs Grand Prix, won by KCAA.GN from South Korea, alongside the Asian Pastry Cup, FHA Bakery Challenge and FHA Dessert Challenge. Winners included Japan in the Asian Pastry Cup, China in the bakery competition and Sohee Kim from South Korea in the dessert category.
The next edition is scheduled for April 20-23, 2027.
